R183-Z96-AAV1

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R183-Z96-AAV1

Rack Server - AMD EPYC™ 9004 - 1U DP 8-Bay Gen5 NVMe/SATA/SAS-4 Titanium

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Dual AMD EPYC™ 9004 Series Processors (with AMD 3D V-Cache™ Technology)
12-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x 1Gb/s LAN ports via Intel^® I350-AM2
4 x 3.5"/2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
4 x 2.5" 9.5mm Gen5 NVMe/SATA/SAS-4 hot-swappable bays
3 x M.2 slots with PCIe Gen3 x4 and x2 interface
2 x FHHL PCIe Gen5 x16 slots
2 x OCP 3.0 Gen5 x16 slots
Dual 1600W 80 PLUS Titanium redundant power supply

快速達交產品更多快速達交產品更多 R183 系列快速達交產品 R183-Z94-AAD1R183-Z94-AAV1R183-S92-AAD1R183-S92-AAV1

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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 815

Motherboard

MZ93-FS1

CPU

AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C

Supports EPYC 9654 cTDP 400W, OCP3.0 ≦ 21W at ambient 30°C.

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s

LAN

Rear side:
2 x 1Gb/s LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Storage

Front side:
4 x 3.5"/2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
4 x 2.5" 9.5mm Gen5 NVMe/SATA/SAS-4 hot-swappable bays
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1)
- (SATA from CPU_0)

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

N/A

Expansion Slots

PCIe Cable x 2:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_0
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_1

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_1
Supports NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x2, from CPU_1
- Supports 2280/22110 cards

Internal I/O

1 x TPM header

Front I/O

1 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 1600W 80 PLUS Titanium redundant power supply

AC Input:
- 100-240V~/ 12-9.5A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 9.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 82A
+12Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+12.2V/ 131.2A
+12Vsb/ 3A

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

8 x 40x40x56mm (32,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 23.16 kg
Gross Weight: 25.27 kg

Packaging Dimensions

1045 x 595 x 249 mm

Packaging Content

1 x R183-Z96-AAV1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR183Z96DR000AAV1*
- Motherboard: 9MZ93FS1UR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0206-K0R
- CPU heatsink: 25ST1-553202-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1013: 9CFP1013NR-00
- Backplane board - CBP1048: 9CBP1048NR-00
- Backplane board - CBP1049: 9CBP1049NR-00
- Fan module: 25ST2-40562H-A0R
- G-SCM board - CDCR114: 9CDCR114NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-21600E-L0S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- RMA packaging: 6NR183Z96SR-RMA-A100

* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。